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Rigid PCB Capabilities
In the table below is a key PCB capability list of GLinkPCB’s printed circuit board manufacturing. This table is designed to help you understand if our capabilities are a match for your design. It will also allow you to plan ahead and create your design within these capabilities so that you can be sure we can produce your PCB.
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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Layer count
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1 - 32 layers
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Quantity of copper layers on the board
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Impedance
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For 4, 6, 8, 10, 12, 14, 16, 18, 20 layers PCB, PCB Stackup designed by NextPCB(by default), or PCB Stackup designed by customers
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Layer Stackup Structure
Impedance Calculation Parameter |
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Impedance tolerance
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±10%
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Material
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22F、CEM-1、FR-1、FR-4、PTFE、Rogers
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TG≥130、TG≥150、TG≥170
CTI≥175、CTI≥250、CTI≥600 |
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PCB material dielectric constant
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DK 2.17～25
DF 0.001～0.0025 |
Prepreg dielectric constant
prepregtype: 7628/1080/2313/2116 |
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Max. dimension
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1-2 layers: 1200*500mm
4-20 layers: 800*500mm |
The maximum dimension that GLinkPCB can do
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Min. dimension
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Length and width ≥4mm
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Min. dimension = 4*10mm
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Dimension tolerance
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CNC: ±0.10mm, V-CUT: ±0.2mm
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±0.15mm for CNC routing, and ±0.2mm for V-scoring
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PCB thickness
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0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.0/3.2/4.0/5.0/6.0mm
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The thickness of finished board
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Thickness tolerance
( Thickness≥1.0mm) |
±10%
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e.g. If the board thickness is 1.6mm, the finished board thickness ranges from 1.44mm(1.6-1.6×10%) to 1.76mm(1.6+1.6×10%)
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Thickness tolerance
( Thickness < 1.0mm) |
±0.1mm
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e.g. If the board thickness is 0.8mm, the finished board thickness ranges from 0.7mm(0.8-0.1) to 0.9mm(0.8+0.1)
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Finished copper weight
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0.5 oz ～ 20 oz
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Finished copper weight of outer layer could be 0.5 oz ～ 20 oz
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Inner copper weight
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0.5 oz ～ 10 oz
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Finished copper weight of inner layer could be 0.5 oz ～ 10 oz
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Surface finish
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HASL/Lead free HASL/ENIG/OSP/ENEPIG
Immersion Tin/Immersion silver |
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HDI structure
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Rank 1 /Rank 2 /Rank 3/Anylayer HDI
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Mechanical blind buried vias or laser blind buried vias(electroplating Via-filling is available) or laser blind vias filling dimple ≤ 15µm
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Electrical test
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Flying Probe/Special test fixture
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No limits for Flying Probe. Max. 14000 Pads can be tested by PCB test fixture
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Beveling angle of gold finger
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20°/30°/45°/60°
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Beveling angle tolerance of gold finger
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±5°
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Beveling depth tolerance of gold finger
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±0.1mm
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Outline tolerance
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±0.1mm
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V-CUT angle
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30°/45°/60°
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Number of V-CUT
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≤30 cuts
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V-CUT outline size
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55mm ≤ length/width ≤ 480mm
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V-CUT residue thickness
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0.25mm ≤ v-cut residue thickness ≤ 0.4mm
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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Drill hole size(Mechanical)
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0.10-6.5mm
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Min. drill hole size: 0.10mm(available for PCB thickness ≤ 1.2mm) Max. diameter of drilling bits is 6.5mm(contact marketing@glinkpcba.com if your customed hole size > 6.5mm)
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Drill hole size tolerance
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≤0.05mm
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Blind/Buried vias
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Mechanical blind buried vias: copper thickness of blind vias ≥ 20µm
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Laser blind buried vias: dimple ≤ 10µm
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Via pad size
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≥0.1
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The pad hole size will be enlarged 0.125mm in production
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PTH hole size
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0.2mm (for single side)
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The annular ring size will be enlarged to 0.2mm in production
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Min. non-plated holes
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0.4mm
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Min. plated slots
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0.5mm
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Min. non-plated slots
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0.5mm
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Min. castellated holes
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0.5mm
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The minimum diameter of castellated holes is 0.50mm
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Hole size tolerance(Plated)
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±0.075mm
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e.g. If customed Plated hole size is 1.000mm, the finished hole size could be between 0.925mm to 1.075mm
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Hole size Tolerance(Non-Plated)
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±0.05mm
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e.g. If customed Non-Plated hole size is 1.000mm, the finished hole size could be between 0.95mm to 1.05mm
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Rectangle hole/Slot
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With or without fillet angle
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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1 oz Copper
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3.5mil (single side) (3.5mil≈0.09mm)
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2 oz Copper
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4.5mil (single side) (4.5mil≈0.11mm)
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Items
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Manufacturing Capabilities
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Patterns
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Hole to hole clearance(Different nets)
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≥12mil(Avoid conductive anodic filament)(12mil≈0.30mm)
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Via to via clearance(Same nets)
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≥8mil (8mil≈0.20mm)
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SMD pad to SMD pad clearance(Pad without hole, different nets)
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≥0.15mm
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Pad to pad clearance(Pad with hole, different nets)
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≥0.40mm
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Via to track
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≥7mil (7mil≈0.18mm)
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PTH to track
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≥9mil (9mil≈0.23mm)
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NPTH to track
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≥8mil (8mil≈0.20mm)
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SMD pad to track
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≥4mil (4mil≈0.10mm)
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Copper weight
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Min. trace width
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Min. spacing
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Patterns
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H/HOZ(0.5oz Inner layer)
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2.5mil (2.5mil≈0.06mm)
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3mil (3mil≈0.08mm)
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1 oz(Outer layer)
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3mil (3mil≈0.08mm)
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3mil (3mil≈0.08mm)
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2 oz(Outer layer)
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5.5mil (5.5mil≈0.14mm)
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5.5mil (5.5mil≈0.14mm)
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Layer count
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Min. BGA pad dimensions
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Min. distance between BGA
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Min. spacing between the center of two BGAs
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Patterns
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1 oz
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≥0.2mm
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0.15mm
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0.45mm
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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Solder mask opening/expansion
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≥1.5mil (1.5mil≈0.04mm)
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There should be a minimum size of 1.5mil "solder mask opening" around the pad to allow for any misregistration
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Solder bridge
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Green: 3.5mil
Black/White: 5mil other solder mask: 4mil |
To build solder bridge, the spacing between copper pads edge must be 3.5mils or more
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Solder mask color
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Green/Red/Yellow/Blue/White/ Matte Black/Black
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Solder mask dielectric constant
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3.5
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Solder mask thickness
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Solder mask thickness on base material: 0.8mil, solder mask thickness on copper: 0.6mil
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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Minimum line width
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Silkscreen printing≥5mil (5mil≈0.12mm)
Printer printing≥3mil (3mil≈0.08mm) |
Characters width < 3mil(0.076mm) will be unidentifiable
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Minimum text height
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Silkscreen printing≥30mil (30mil≈0.76mm)
Printer printing≥24mil (24mil≈0.61mm) |
Characters height < 24mil(0.61mm) will be unidentifiable
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Character width to height ratio
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≥ 6:1
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The preferred ratio of width to height is 6:1
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Pad to silkscreen
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>6mil (6mil≈0.15mm)
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The minimum distance between pad and silkscreen is 0.15mm
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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Trace to outline
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≥0.2mm
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Individual board(Rounting): Trace to Outline ≥ 0.2mm
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Trace to V-cut line
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≥0.4mm
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Panel board with V-scoring: Trace to V-cut line ≥0.4mm
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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Panelization without space
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0mm
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No space between panelized PCBs
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Panelization with space
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≥1.6mm
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The space between panelized PCBs should ≥ 1.6mm, if not, the routing process may be difficult and low efficiency
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Panelized round board
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≥80mmx80mm
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Stamp Hole: hole size=0.5mm, copper gap=0.35mm, 5-7holes for a set by default
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Panelized castellated holes board
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Panelize with stamp holes and add tooling strips on four board edges
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The distance between castellated hole and board corner should be > 4mm
Recommended diameter of stamp hole is 0.5mm-0.8mm Recommended distance between the two stamp holes is 0.2mm-0.3mm |
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Min. width of breakaway tab
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≥4mm
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The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm
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Min. edge rails
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≥3mm
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If you choose panel by NextPCB, we will add 3mm edge rails on both sides by default
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Items
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Manufacturing Capabilities
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Notes
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Patterns
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PADS
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copper-pour pattern
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GLinkPCB Fab uses hatch pattern by default, please note your copper-pour pattern when placing an order
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2D line
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Valid lines cannot be placed in the corresponding layer as 2D lines, NextPCB does not process 2D lines
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Altium Designer Protel
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Version
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There are elements missing issues in generating Gerber files from different versions of Altium Designer. Please note your version No. of Altium Designer when placing an order
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Parts outside PCB
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If the components were placed far away from the PCB board, file generating would failed because the boundary of the board is too large
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solder mask opening
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Please do not put the opening of the solder layer on the paste layer by mistake, GLinkPCB does nothing to the paste layer
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copper-pour pattern
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Fill pattern: too much filling region will causing region missing when generating a file, Tip: choosing Polygon copper-pour pattern
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